DANLERS
Designed and Manufactured in the UK
DANLERS
Designed and Manufactured in the UK
DANLERS CEM surface mount equipment
Paste printed directly from customer data (Gerber, CAD, etc). No need to use stencils for the application of solder paste, ideal for “high density” boards. Minimises need for reworking.
Components electronically tested before placement. Components sizes can range from 01005 to 56 x 56mm. Capabilities cover Ball Grid Arrays (BGA) and QFP. Rated speed of up to 34 000 components per hour. Vapour phase reflow with anti-tombstoning
DANLERS Limited is an ISO9001 and ISO14001 certified company
WEEE PRN: WEEE/BA5544YX | WEEE recycling: dispose of electrical equipment via approved recycling routes.